Scribe and break processing
Introducing a cutting method that uses dry processing without water and allows for high-speed processing.
"Scribe & Break processing" is a cutting method that utilizes the physical properties of the processing material. It is a dry processing method that does not use water, and it allows for high-speed processing. On the other hand, it is significantly influenced by the material's physical properties (especially crystal orientation), making it challenging to determine the processing conditions. Additionally, the scribe & break technique has been used for a long time as a method for cutting hard and brittle materials like glass. 【Features】 ■ Support for fine processing - Suitable for cutting small chips from thin substrates - Minimal vibrations during processing, so chips rarely fly off ■ Support for curved processing - Capable of processing curves (3D processing) in applications - Laser scribing allows for cutting with even smaller radii *For more details, please refer to the PDF document or feel free to contact us.
- Company：三星ダイヤモンド工業
- Price：Other
